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Probe Technology Ltd.
Plastronics Burn-In Sockets










Tel: +44 (0)1355 221228                        Fax: +44 (0)1355 234855                        e-mail: sales@probetechnology.co.uk
Open top QFN socket













Lidded QFN socket














Specification:

  • Available in 0.40 up to 2.54mm pitch designs
  • Custom pitches down to 0.40mm
  • Lidded and open top sockets for 3mm - 10mm packages
  • Lidded sockets for 10mm - 16mm packages
  • Center ground pin standard for all sockets
  • Optional copper heat slug available for high wattage devices
  • Sockets for over 160 different JEDEC standard footprints
  • Thru-hole mounting to board
  • -50ºC to +150ºC operating temperature













Dual row QFN socket
















Open top BGA socket with cam handle















Open top BGA ZIF socket (push cover)
















QFN Burn-in sockets

Plastronics have designed & developed socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The open top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
BGA Burn-in Sockets

Plastronics currently offers the largest selection of Ball Grid Array (BGA) sockets in the industry with over 400 options including 0.50mm, 0.75mm, 0.80mm, 1.0mm, 1.27mm and 1.5mm pitch sockets.  All sockets can be modified to accept package sizes up to 50mm depending on pitch. By eliminating the lid, the open top sockets can accommodate virtually any thickness BGA device with uniform, low contact resistance.




Using a cam handle or open top (for automated loading/unloading), the open top BGA sockets provide true zero insertion force (ZIF) socket loading. The zero insertion force open top socket can accommodate in excess of 1000 solder balls. All contact forces, regardless of solder ball count, are contained within the socket and are not transferred to the burn-in board, eliminating bowing and concurrent difficulty in contacting the solder balls. The open top BGA sockets provide maximum air-flow, minimizing heat related damage to devices. With burn-in temperatures as high as 150°C and electrical currents running through the package, maximum convective heat transfer is attained with the open top socket.
LCC Burn-in Sockets

Plastronics’ LCC sockets have been in use for test and burn-in since 1982 providing a low-cost, reliable test solution for manual and automatic loading. Offering the widest selection of LCC sockets in the world, Plastronics now offers 3 new socket options specifically designed for Amkor’s VisionPak® packages. These sockets are designed for packages to be inserted “Live-Bug” with the glass top up, since access to the top may be required during test.

Specification:

  • Pin counts from 16 to 124
  • Excellent for VisionPak® LCC devices
  • Thru-hole mounting to board
  • ZIF socket operation (push cover 3 mm stroke)
  • -65°C to +150°C operating temperature